Cover image for Ceramic integration and joining technologies : from macro to nanoscale
Title:
Ceramic integration and joining technologies : from macro to nanoscale
Publication Information:
Hoboken, NJ. : Wiley-American Ceramic Society, 2011.
Physical Description:
xiv, 318 p. : ill. ; 25 cm.
ISBN:
9780470391228
General Note:
Includes index.
Abstract:
"This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage. This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators"-- Provided by publisher.
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PSZ JB 30000010281254 TA455.C43 C466 2011 Open Access Book Book
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Summary

Summary

This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage.

This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators. The engineering challenge of designing and manufacturing complex structural, functional, and smart components and devices for the above applications from smaller, geometrically simpler units requires innovative development of new integration technology and skillful adaptation of existing technology.


Author Notes

Mrityunjay Singh, PhD, FASM, FACerS, FAAAS, is Chief Scientistat Ohio Aerospace Institute, NASA Glenn Research Center, and isactively involved in various activities related to processing,manufacturing, joining and attachment technologies. He isAcademician of World Academy of Ceramics and Governor of ActaMaterialia, Inc. He has authored or coauthored more than twohundred thirty publications, edited forty two books/journalvolumes, and holds several patents and technology transfers toindustries. He is recipient of numerous (more than forty) nationaland international awards from all over the world including fourR&D 100 awards, NASA Public Service Medal, and NASA ExceptionalSpace Act Award for outstanding and extraordinary contributions tovarious NASA programs.

Tatsuki Ohji, PhD, FACerS, is the Prime Senior ResearchScientist at Japan's National Institute of Advanced IndustrialScience and Technology (AIST). His research interests includecharacterization of ceramics, ceramic composites and porousmaterials, design of advanced ceramics, and green ceramicmanufacturing. He has authored or coauthored more than 320scientific papers and nine books, and holds more than fortypatents. He is a fellow of the American Ceramic Society,Academician of the World Academy of Ceramics, a Governor of ActaMaterialia, Inc., and editorial board member of many internationaljournals.

Rajiv Asthana, PhD, FASM, is a professor at the University ofWisconsin-Stout where he teaches in the manufacturing engineeringand engineering technology programs. His research interests includeceramic/metal joining, high-temperature capillarity and castmetal-matrix composites. He is the author or coauthor of four booksand 150 refereed papers, an Associate Editor of Journal ofMaterials Engineering & Performance, guest editor and editorialboard member of several refereed journals, and a fellow of ASMInternational.

Sanjay Mathur, PhD, is professor at the Institute of InorganicChemistry at the University of Cologne, Germany. The major researchthrust of his group include chemical synthesis of functionalnanostructures and their processing for product and deviceapplications. He was an Alexander von Humboldt Fellow at theSaarland University, where he accomplished his Habilitation. He hasauthored or coauthored over 150 publications, edited a book, holdsseveral patents, and is and Associate Editor of InternationalJournal of Applied Ceramic Technology and Nanomaterials.


Table of Contents

Mrityunjay Singh and Tatsuki Ohji and Rajiv Asthana and Sanjay MathurJolanta Janczak-RuschMonica Ferraris and Milena Salvo and Valentina CasalegnoK. S. Weil and J. T. Darsell and J. Y. KimMichael C. Halbig and Mrityunjay SinghMrityunjay Singh and Rajiv AsthanaV. M. Perevertailo and O. B. LoginovaRichard MatzRyoji Fitnahashi and Saori Urata and Atsuko Kosuga and Delpkine FlahautYoshinobu Fujishiro and Toshio Suzuki and Toshiro Yamaguchi and Koichi Hamamoto and Masanobu Awano and Nigel SammesWoosuck Shin and Maiko Nishibori and Ichiro MatsubaraTalha Erdem and Hilmi Volkan DemirTakashi GotoCher Ming Tan and Yuejin HouAshok Kumar and Supriya Ketkar and Venkataraman GurumurthyJun AkedoYoshitake Masuda and Kunihito KoumotoF. Herndndez-Ramirez and J. D. Trades and A. Romano-Rodriguez and S. Barth and H. Shen and S. MathurXijun Li and Daniel H. C. ChuaD. Pliszka and S. Sundarrajan and S. RamakrishnaC. Jin and W. Wei and R. Aggarwal and R. J. NarayanAtaur Safkar and M. Saif IslamUmur Caglar and Ville Pekkanen and Jani Valkama and Pauliina Mansikkamdki and Jussi PekkanenMasakazu Kawashita and Toshiki Miyazaki and Chikara Ohtsuki
Prefacep. ix
Contributorsp. xi
Part I Introductionp. 1
1 Ceramic Integration Across Length Scales: Technical Issues, Challenges, And Opportunitiesp. 3
Part II Science And Technology For Macroscale Integrationp. 15
2 Ceramic Component Integration By Advanced Brazing Technologiesp. 17
3 Joining And Integration Issues of Ceramic Matrix Composites For The Nuclear Industryp. 39
4 Air Brazing: A New Method of Ceramic-Ceramic And Ceramic-Metal Joiningp. 91
5 Difusion Bonding of Silicon Carbide As An Enabling Technology For The Fabrication of Complex-Shaped Ceramic Componentsp. 143
6 Integration of Carbon-Carbon Composite To Metallic Systems For Thermal Management Applicationsp. 163
7 contact Interaction In Carbon-Metal Systems ForJoining And Integrationp. 193
part III integration Issues In Energy Generation And Device Fabricationp. 231
8 integration Technologies For Ferrites And Power Inductors In Ceramic Circuit Boardsp. 233
9 oxide Thermoelectric Power Generationp. 267
10 integration Technologies For Solid Oxide Fuel Cells (Sofcs) And Other Electrochemical Reactorsp. 297
11 integration Technologies For Sensorsp. 323
12 on-Chip Integration Of Functional Hybrid Materials And Components In Nanophotonics And Optoelectronicsp. 339
13 Integration Of Multifunctional Properties In Thermal Barrier Coatings By Chemical Vapor Depositionp. 393
14 the Changing Physics In Metal Interconnect Reliabilityp. 415
15 integration Issues Of Barium Strontium Titanate Thin Film For Tunable Microwave Applicationsp. 449
16 aerosol Deposition (Ad) Integration Techniques And Their Application To Microdevicesp. 489
part IV nano- And Biointegrationp. 521
17 Advances In Nano Integration Methodologies: Patterning, Positioning, And Self-Assemblyp. 523
18 Integration Of Nanowires In New Devices And Circuit Architectures: Recent Developments And Challengesp. 575
19 Integrating Diamond-Like Carbon Into Nanostructure Designs (Fabricating Microscale And Nanoscale Architectures Of Diamond-Like Carbqn Films)p. 641
20 Synthesis, Properties, Integration, And Applications Of Vertically Aligned Ceramic Nanostructuresp. 671
21 Nanointegration Based On Thin-Film Technologyp. 699
22 mass-Manufacturable Nanowire Integration: Challenges And Recent Developmentsp. 721
23 Usability Of Ink-Jet Printing Technology And Nanomaterials In Electrical Interconnections, Electronic Packaging, And System Integration For Microelectronics Applicationsp. 743
24 biointegration Of Prosthetic Devicesp. 777
Indexp. 803