Cover image for Damping signature analysis for wire bonding machine condition monitoring
Title:
Damping signature analysis for wire bonding machine condition monitoring
Series:
Siri kertas kerja penyelidikan (Universiti Teknologi Malaysia. Pusat Pengurusan Penyelidikan)
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2000
Subject Term:

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Item Category 1
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PRZS 30000010032521 TK5102.9 D35 2000 Closed Access Book
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PSZ JB 30000010032520 TK5102.9 D35 2000 Open Access Book Proceedings, Conference, Workshop etc.
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PSZ JB 30000010032519 TK5102.9 D35 2000 Open Access Book Proceedings, Conference, Workshop etc.
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PSZ KL 30000010032518 TK5102.9 D35 2000 Open Access Book
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